| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum suction apparatus which can eliminate particles adhered to a placing part or the like of a vacuum suction apparatus without needing manual cleaning work or the like, and can restrain complication of device structure and increase of manufacturing cost by realizing elimination of particles with simple constitution, and to provide a substrate transport plate and substrate processing equipment. SOLUTION: When a semiconductor wafer W is sucked and held and it is conveyed, a changeover value 5 is switched to suction source 4 side, Suction of a suction opening 2c is performed through a suction lateral 1a, and the semiconductor wafer W is sucked and held on the placing part 2. When cleaning of the changeover 2 is performed, the changeover valve 5 is switched to cleaning gas supply source 6 side, and gas for cleaning (e.g. air, nitrogen gas, etc.) is supplied from the cleaning gas supply source 6, through a suction lateral 3 and the suction lateral 1a. The gas is spouted from the suction opening 2c. COPYRIGHT: (C)2004,JPO |
