| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which an expansion pressure and temperature difference between the inside of a hollow and the outside caused by heating a set-up substrate of the semiconductor device at mounting are eliminated, and no failure such as detachment at a bonding part between a cap and a frame, detachment at a boundary surface between the frame and a lead frame, nor dew condensation in the inside of the hollow is occurred. SOLUTION: A semiconductor device 1A of the first embodiment of this invention comprises a lead frame 2 acting as a wiring board, a hollow frame 8A which is provided on the lead frame 2, and whose upper part is opened, while grooves 81 are formed at least at two points of the upper edge of the opening of the frame, a semiconductor element S mounted on the lead frame 2 in the frame 8A, and a cap 9 closing the opening of the frame 8A. COPYRIGHT: (C)2004,JPO |
