EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL-CLAD LAMINATED SHEET, AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for printed wiring board excellent in heat resistance and moldability. SOLUTION: This epoxy resin composition contains an epoxy resin and a phenol-based curing agent. The number of the functional groups of the total phenol-based curing agents having not more than two functional groups occupies 20-50 % of the total functional groups of the total phenol-based curing agents, and it contains an imidazolesilane. It can widen the range of moldable gel time and enhance moldability. With the use of the phenol-based curing agent and the imidazolesilane, the range of moldable gel time can be widened and moldability can be enhanced while keeping its high heat resistance. COPYRIGHT: (C)2004,JPO