| 摘要 |
PROBLEM TO BE SOLVED: To hold a wafer or the like within a processing apparatus without dust caused by impulse or friction of a holding member and the wafer or without damage by conveying the wafer to a predetermined position accurately in a short time in a manufacturing facility for a plate-like electronic component. SOLUTION: The wafer is held while controlling an operating speed and decelerating the speed just before contact with the wafer by a first holding member 21 provided on the top of an end effector 10 which is connected to be turnable with an arm 12 of a conveyer robot 4, and a motor-driven second holding member 22. In order to deal with a size error of the wafer, a spring member 25 is provided between the second holding member 22 and a motor driving part to impart a fixed pressure to the wafer at all the time. COPYRIGHT: (C)2004,JPO |
