MANUFACTURING METHOD OF MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board provided with blind via holes and plated through-holes filled with plating having high connection reliability without having adverse effect on the plated through-holes due to adhesion of an additive agent of plating liquid for via filling.

SOLUTION: The manufacturing method of the multilayer printed circuit board includes the steps of: forming the blind through-holes and the through-holes to an outermost layer of a multilayer printed circuit board; thereafter applying electroless copper plating / copper electroplating to the entire face; and thereafter applying via filling to the entire face by electroplating. The manufacturing method of the multilayer printed circuit board includes the steps of: forming the blind through-holes and the through-holes to the outermost layer of the multilayer printed circuit board; thereafter applying electroless copper plating to the entire face; thereafter applying via filling to the entire face by electroplating; thereafter cleaning the entire face including the through-holes; and applying the copper electroplating to the entire face.

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