| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold package which enables a resin flowing into upper and lower cavities to be balanced and equally filled by forming a gate from the side short edge hitting the resin feeding entrance of the cavity, and its manufacture method. SOLUTION: The manufacturing method of the mold package includes the processes which comprise a process of preparing a semiconductor device having a long edge provided with a lead terminal and the short edge not provided with the lead terminal, a process of preparing an upper die having the upper cavity, a process of preparing a lower die having the lower cavity where the gate gradually moving upward from one end to the other end is formed, a process of arranging the semiconductor device in the space formed by the upper cavity and the lower cavity so that the short edge of the semiconductor device may oppose the gate and a process of feeding a plasticized resin into the space formed by the upper cavity and the lower cavity via the gate. COPYRIGHT: (C)2004,JPO |
