SOLDERING QUALITY DETERMINING METHOD, DEVICE AND SYSTEM, AND PRINTED BOARD MANUFACTURING SYSTEM AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To improve the precision of determining the quality of a solder fillet for accurately detecting mounted components soldered in inclination to a printed board. SOLUTION: An XY table is controlled to be driven for moving a capacitor on a PCB into an imaging region of a high-speed camera and the PCB is irradiated with a RGB light from each light source. The reflected light is imaged by the high speed camera to obtain an image color-coded corresponding to the inclination of a reflected plane. At this time, if the solder fillet is normally formed outside two electrodes of the capacitor, its solder fillet portion is shown in a blue color. In this method, a sum S1of the number of pixels in a blue color region existing on both sides of the electrodes is calculated, and then if the sum is greater than eight pixels, the solder fillet of the capacitor is determined to be good. Thus, the quality of the solder fillet can be highly precisely determined for every capacitor. COPYRIGHT: (C)2004,JPO