| 摘要 |
PROBLEM TO BE SOLVED: To solve such problems that on performing molding with the use of a pair of molds having pins embedded in one mold alone as the molds for molding a holding plate to be used in coating an external electrode of a miniature electronic part, great strength is required for drawing the pins, and simultaneously the core material is curved in stripping the pins. SOLUTION: The molds for molding the holding plate reduce the load on removing the holding plate from the molds and prevent the holding plate from warping and twisting by embedding the pins to be provided in the molds for forming holes in the holding plate dividedly in the mold of the fixed side and the mold of the movable side. COPYRIGHT: (C)2004,JPO |
