| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate retaining apparatus that can prevent the racing of a semiconductor substrate without giving any deviation in a rotational speed and to provide a method for polishing the semiconductor substrate. <P>SOLUTION: The substrate retaining apparatus 10 comprises: a top ring 2 for retaining the semiconductor substrate 1 being a substrate to be polished; a retainer ring 3 provided at the outer-periphery section of the semiconductor substrate 1; and a fluid chamber 6 that is provided inside the tip ring 1 and presses the semiconductor substrate 1 against the polishing surface of a polishing apparatus by pressurizing the semiconductor substrate 1 via an elastic film 4. A groove 4a is provided on the surface of the elastic film 4 in contact with the semiconductor substrate 1. <P>COPYRIGHT: (C)2004,JPO |
