| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition containing a heat resistant resin having photosensitivity, a method for manufacturing patterns using the same, and electronic components. <P>SOLUTION: The positive photosensitive resin composition contains (A) a polymeric compound having at least one phenolic hydroxyl group or carboxyl group in the molecule, (B) a compound generating an acid by irradiation with active rays, and (C) a compound having an organic group convertible to carboxylic acid by an acid catalyst effect, and has excellent sensitivity and resolution. <P>COPYRIGHT: (C)2004,JPO |
