| 摘要 |
PROBLEM TO BE SOLVED: To provide chip-bonding equipment that can shorten the unit process time and improve the efficiency of the bonding operation. SOLUTION: The chip-bonding equipment, which uses an ACF8 (an anisotropic conductive material) to bond a chip 3 onto a substrate 1, is equipped with two transfer mechanisms 21, that transfer an ACF to a substrate 1 via a transfer head 23 by using an ACF tape for an ACF transfer station 20, and aligns an alignment pitch of the transfer mechanisms 21 having a pitch P of a transfer object position on the substrate 1 by using a lead-screw mechanism 26. Hence, it is possible to concurrently execute an ACF transfer to plural positions, thus reducing the total unit process time and improving the bonding operation. COPYRIGHT: (C)2004,JPO
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