| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer in which it is possible to suppress occurrence of continuity defects between electrodes of a first board (a main board) and a second board (a sub board) caused by the thermal deformation of the interposer occurring at a high-temperature heating test or a device heating test, and moreover, its manufacturing yield can be improved, and the manufacturing process time can be shortened. SOLUTION: The interposer is interposed between the first board 1, having a larger space between adjacent electrodes 4 each other and the second board 2 having a smaller space between adjacent electrodes 7 to each other. The interposer comprises a connector 11 for electrically conducting and connecting corresponding electrodes 5, 8 for connection in both boards 1, 2 and a support plate for supporting the connector. The interposer is so constituted that a plurality of sheets of the small-diameter interposers A-D, comprising small-diameter support plates 15-18 and the connector 11 supported by the small-diameter support plates 15-18, are arrayed along the face of the first board 1 in a plane. COPYRIGHT: (C)2004,JPO
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