| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip body in which a space between chips is expanded without a conventional expanded process in a process for manufacturing a chip body such as a semiconductor chip, and an adhesive sheet for manufacturing the chip body used properly in the manufacturing method. SOLUTION: The adhesive sheet for manufacturing a chip body has an adhesive layer for sticking a material that is cut, a shrinkable film, and an extensible film stacked, in this order. Preferably, the extensible film has an elastic modulu of less than 1×10<SP>9</SP>N/m<SP>2</SP>, the adhesive layer comprises a radiation curing adhesive, and the heat-shrinkable film and the extensible film are stacked via an adhesive layer having an elastic modulus of not less than 1.0×10<SP>5</SP>N/m<SP>2</SP>. COPYRIGHT: (C)2004,JPO |
