| 摘要 |
PROBLEM TO BE SOLVED: To provide a position detecting method and an aligner which are capable of carrying out very robust alignment even when there are wafer processing errors (Wafer Induced Shift) and errors induced by a device (Tool Induced Shift). SOLUTION: The position detecting method and a position detecting device are equipped with an acquisition means acquiring alignment actual waveforms from the aligner, and a generating means which generates simulation waveforms by the use of the surface information of a resist or a wafer underlying layer obtained from a three-dimensional form measuring device. After TIS and WIS are determined so as to make the alignment actual waveforms identical with the simulation waveforms, a plurality of waveforms are generated by applying TIS and WIS on the basis of the determined simulation waveforms, signal processing or signal processing parameters are optimized on the basis of the waveforms, and the result is fed back to the aligner. COPYRIGHT: (C)2004,JPO |
