| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a stacked ceramic electronic part capable of reducing delamination caused at the time of baking. SOLUTION: A first ceramic coated layer 51 is formed, and a first electrode group 61 and a first assistant layer 65 are formed on the first ceramic coated layer 51. The thickness of the first assistant layer 65 is equal to that of the first electrode group 61, and a second ceramic coated layer 52 is formed on the first electrode group 61 and the first assistant layer 65. A second electrode group 62 is formed on the second ceramic coated layer 52, and a third ceramic coated layer 53 is formed on the second ceramic coated layer 52 and the second electrode group 62. COPYRIGHT: (C)2004,JPO
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