METHOD FOR HANDLING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a handling method of a semiconductor chip with which adhesiveness of a lead frame against a chip preserved on an adhesive tape for long time can be improved. SOLUTION: The semiconductor chip 1 is stuck to the adhesive tape 2 using adhesive 3 comprising fatty acid amide so as to preserve it. The semiconductor chip 1 is peeled off from the adhesive tape 2 before shipping of the semiconductor chip 1. Fatty acid amide stuck to the semiconductor chip 1 that is peeled off is removed. The semiconductor chip 1 that is peeled off is irradiated with ultraviolet light. Thus, stuck fatty acid amide is removed. COPYRIGHT: (C)2004,JPO