| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment and a method wherein uniformity of critical size of a wafer edge is improved by compensation of flare effect emerging on the wafer edge. SOLUTION: A problem of variations of wafer edge critical size is solved by using an exposure plate arranged on a retaining pin by which a wafer table of a stepper is made to progress and retreat. An inclination angle of the exposure plate is adjusted with the retaining pin, and the exposure plate is tilted together with a wafer, thereby maintaining the same plane as a wafer surface. COPYRIGHT: (C)2004,JPO
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