SUBSTRATE FOR HEAT SINK, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To form a substrate for a heat sink in a high efficiency of a kneaded material of an inorganic filler and a thermosetting resin for the substrate which mounts circuit components. SOLUTION: The substrate 109 for the heat sink includes a surface of a circuit substrate 107 brought into contact with a top surface of at least one mounting component 108 provided on the substrate 107 and is made of the kneaded material of the inorganic filler, the thermosetting resin and a pregel material. COPYRIGHT: (C)2004,JPO