发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the influence of a temperature fluctuation of a substrate with respect to an external temperature fluctuation of a reaction chamber and to assure the uniformity of the film thicknesses of substrates between batches and to improve quality by measuring an environmental temperature and performing the temperature control corresponding to the fluctuation in the environmental temperature. SOLUTION: At the outside of the reaction chamber 10, a thermocouple 42 for measuring the environmental temperature capable of measuring the peripheral temperature thereof is provided and a target temperature is corrected on the basis of the measured temperature of the thermocouple 42. Feedback control is then performed in such a manner that the deviation between the corrected target temperature and the measured value of a plate heater 16 or the measured temperature of a susceptor for holding the substrate is made to be zero. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004115904(A) 申请公布日期 2004.04.15
申请号 JP20020285229 申请日期 2002.09.30
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKANO MINORU
分类号 C23C16/52;H01L21/205;(IPC1-7):C23C16/52 主分类号 C23C16/52
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