发明名称 |
Semiconductor device and fabrication method of the same |
摘要 |
A semiconductor device includes semiconductor chips, a first conductive pattern, an external terminal and an encapsulating resin. Each of the semiconductor chips has a front side formed with integrated circuits and a back side. The semiconductor chips are stacked each other. The first conductive pattern electrically connects the integrated circuits. The external terminal is electrically connected to the first conductive pattern. The encapsulating resin encapsulates the semiconductor chips and the first conductive pattern.
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申请公布号 |
US2004070064(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030681283 |
申请日期 |
2003.10.09 |
申请人 |
YAMANE TAE;KATSUNO JYOUJI;FUKAYA KIYOHISA |
发明人 |
YAMANE TAE;KATSUNO JYOUJI;FUKAYA KIYOHISA |
分类号 |
H01L25/18;H01L23/31;H01L25/065;H01L25/07;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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