发明名称 |
Semiconductor package with enhanced chip groundability and method of fabricating the same |
摘要 |
A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. Therefore, a wire-bonding process is merely implemented for power pads and signal I/O (input/output) pads on the chip without having to form ground wires on the ground pads for electrical connection purposes. This benefit allows the use of a reduced number of bonding wires and simplifies wire arrangement or routability. And, a grounding path from the chip through the electrically-conductive wall and electrically-conductive adhesive to the substrate is shorter than the conventional one of using ground wires, thereby reducing a ground-bouncing effect and improving electrical performances of the semiconductor package.
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申请公布号 |
US2004070087(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030452566 |
申请日期 |
2003.05.30 |
申请人 |
SILICONWARE PREC IND CO LTD |
发明人 |
WANG C F;TSAI WEN-TA;JOE YUAN-PING |
分类号 |
H01L21/60;H01L23/48;H01L23/50;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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