发明名称 Slurry flow control and monitor system for chemical mechanical polisher
摘要 A system for controlling and monitoring a rate of flow of a fluid, such as a CMP slurry, comprising a pump for pumping the slurry; a flow meter for monitoring the rate of flow of the slurry; and a controller operably connected to the flow meter and the pump. The controller receives signals from the flow meter indicating the rate of flow of the slurry and controls the operational speed of the pump responsive to the flow meter signals. A degasser equipped with a level sensor may be further provided in the system for removing gas bubbles from the slurry.
申请公布号 US2004071555(A1) 申请公布日期 2004.04.15
申请号 US20020264404 申请日期 2002.10.05
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHEN PING-HSU;CHANG CHAO-JUNG;LO HENRY;PENG CHIN-HSIN;LU CHIEN-KUO
分类号 F04B49/20;(IPC1-7):F04B49/00 主分类号 F04B49/20
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