发明名称 Production method for flexible printed board
摘要 A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.
申请公布号 US2004069649(A1) 申请公布日期 2004.04.15
申请号 US20030638542 申请日期 2003.08.12
申请人 KATAYAMA NAOKI;HAYASHI YASUHIRO;KANG JOONHANENG 发明人 KATAYAMA NAOKI;HAYASHI YASUHIRO;KANG JOONHANENG
分类号 C23C18/20;C23C18/28;C23C18/32;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):H05K3/00;C25D5/02 主分类号 C23C18/20
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