发明名称 |
Production method for flexible printed board |
摘要 |
A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.
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申请公布号 |
US2004069649(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030638542 |
申请日期 |
2003.08.12 |
申请人 |
KATAYAMA NAOKI;HAYASHI YASUHIRO;KANG JOONHANENG |
发明人 |
KATAYAMA NAOKI;HAYASHI YASUHIRO;KANG JOONHANENG |
分类号 |
C23C18/20;C23C18/28;C23C18/32;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):H05K3/00;C25D5/02 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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