| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently dissipate heat generated from a resin-sealed semiconductor chip to the outside. <P>SOLUTION: In a lead frame 10 where a die pad 11 and a heat sink 12 constituted of a thick plate 10b, a frame 13 constituted of a thin plate 10a, a suspended lead 14 and an external connecting lead 15 are integrally formed, and the suspended lead part 14 is connected to the lower face side of the die pad 11 so that a heat dissipation area 14a can be formed. Also, the suspended lead 14 is configured by bending the edge of the die pad 11 side to the upper face side at an obtuse angle, and forming a heat conduction area 14b at the upper side of the die pad 11. <P>COPYRIGHT: (C)2004,JPO |
