Cooling system for electronics with improved thermal interface

摘要

A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.