发明名称 Metallic complexes covalently bound to conjugated polymers and electronic devices containing such compositions
摘要 The present invention relates to polymeric metal complexes comprising metallic complexes covalently bound to conjugated polymers and luminescent materials containing such polymeric metal complexes. The invention further relates to electronic devices in which the active layer includes such polymeric metal complexes.
申请公布号 US2004072018(A1) 申请公布日期 2004.04.15
申请号 US20030625096 申请日期 2003.07.22
申请人 HERRON NORMAN;SIMMONS HOWARD E.;LECLOUX DANIEL DAVID;UCKERT FRANK P. 发明人 HERRON NORMAN;SIMMONS HOWARD E.;LECLOUX DANIEL DAVID;UCKERT FRANK P.
分类号 C07D209/88;C07D271/10;C07D271/107;C07F15/00;C08G61/02;C08G61/12;C09K11/06;H01L51/00;H01L51/30;H01L51/50;(IPC1-7):B32B9/00 主分类号 C07D209/88
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