发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability on such as reflow resistance and swelling characteristics with less inner voids. SOLUTION: This epoxy resin composition comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a polyethylene derivative (D), wherein the epoxy resin (A) comprises a tetramethyl bisphenol F-type epoxy resin, and the polyethylene derivative (D) comprises an ethylene-ethyl acrylate copolymer (d). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004115741(A) 申请公布日期 2004.04.15
申请号 JP20020284432 申请日期 2002.09.27
申请人 TORAY IND INC 发明人 OTSU TAKASHI;TABATA AKIHIRO;TSUJI YOSHIYUKI
分类号 C08L63/02;C08G59/24;C08G59/62;C08K3/00;C08L23/08;H01L23/29;H01L23/31;(IPC1-7):C08L63/02 主分类号 C08L63/02
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