发明名称 METHOD OF MANUFACTURING THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a thermoelectric module by which solder joining of a lead wire having high joining strength can be easily executed without giving damages to a thermoelectric element and a flux does not scatter. SOLUTION: In the thermoelectric module comprising a pair of supporting substrates 1 opposed to each other, a plurality of thermoelectric elements 3 arranged so as to be sandwiched between the supporting substrates 1, wiring conductors 4 for electrically connecting the plurality of thermoelectric elements 3, and terminal electrodes 5 for joining with the lead wire 6 while being electrically connected to the wiring conductor 4, under the condition that a thread solder 7 is supplied to the clearance between the lead wire 6 and the terminal electrode 5 while the lead wire 6 is brought into contact with the terminal electrode 5, at least the terminal electrode 5 and/or the thread solder 7 are irradiated by a laser beam 8 to execute solder joining. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119736(A) 申请公布日期 2004.04.15
申请号 JP20020281910 申请日期 2002.09.26
申请人 KYOCERA CORP 发明人 NAGASAKI KOICHI
分类号 B23K1/005;H01L23/38;H01L35/10;H01L35/34;(IPC1-7):H01L35/10 主分类号 B23K1/005
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