发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the same capable of easily forming a printed circuit board provided with a migration occurrence suppressing effect in the printed circuit board provided with a thinned conductor pattern. SOLUTION: In the printed circuit board 10 provided with the conductor pattern 12 on the surface of an insulation substrate 11, the conductor pattern 12 is provided with a first conductor layer 13 provided on the surface of the insulation substrate 11, and a second conductor layer 15 provided on the surface side of the first conductor layer 13 and constituting the outermost layer of the conductor pattern 12. In the outer surface of the conductor pattern 12, at least on the side surface of the first conductor layer 13, a protection layer 16 thinner than the thickness B of the second conductor layer 15 in a laminating direction is formed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119589(A) 申请公布日期 2004.04.15
申请号 JP20020279171 申请日期 2002.09.25
申请人 DAISHO DENSHI:KK 发明人 SUGIYAMA TEI;KAKUWA TAKAHIRO
分类号 H05K3/24;(IPC1-7):H05K3/24 主分类号 H05K3/24
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