| 摘要 |
PROBLEM TO BE SOLVED: To improve joining strength by inhibiting decrease in thickness of terminals in electronic parts having terminals with Ag used as the main component. SOLUTION: The electronic parts are those equipped with terminals having Ag as the main component and those whose terminals are joined with solder having Sn and Zn as the main component through an Ag-Zn compound layer. The solder having Sn and Zn as the main component desirably contains 5-12% Zn in mass percentage with the remainder substantially composed of Sn, or else it desirably contains 1-10% Bi or 1-5% In, in addition to 5-12% Zn in mass percentage, with the remainder substantially composed of Sn. COPYRIGHT: (C)2004,JPO
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