发明名称 |
Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device |
摘要 |
The present invention provides an integrated circuit having at least one elastically deformable elevation (11) on a circuit substrate (10) of an integrated circuit; a contact-making device (13) on the elevation (11) for providing an electrical link; a rewiring device (12, 14, 15) for electrically connecting an active semiconductor section of the integrated circuit (12) to the contact-making device (13); the rewiring device (12, 14, 15) being formed in ring-shaped fashion around the flexible elevation (11) at the foot of the elevation (11), and this ring (15) being electrically conductively connected to the contact-making device (13). The present invention likewise provides a method for producing a composite comprising a tested integrated circuit (10) and an electrical device (16).
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申请公布号 |
US2004070075(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030637899 |
申请日期 |
2003.08.08 |
申请人 |
HEDLER HARRY;MEYER THORSTEN |
发明人 |
HEDLER HARRY;MEYER THORSTEN |
分类号 |
H01L21/60;H01L23/485;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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