METHOD AND DEVICE FOR WIRE BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for wiring bonding by which wire bonding can be performed without damaging the semiconductor element by detecting the disconnection of the return wire of a discharge current.

SOLUTION: The wire bonding device forms a ball 1a at the front end of a wire 1 extended from the lower end of a capillary 8 by causing an electric torch 17 to discharge electricity by means of a power source 15 for the torch 17. The device is provided with an electrification detecting circuit 50 which detects the voltage on the wire 1 due to the disconnection 18a of the return wire 18 of the discharge current when forming the ball.

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