| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a wafer supporting member provided with a protective layer is used, a temperature controller or inspection device malfunctions as compared with the conventional wafer supporting member not provided with the protective layer and composed of an aluminum nitride etc., and, in addition, another problem that the missing of the wiring formed in a semiconductor wafer occurs. SOLUTION: The main surface of a plate-shaped ceramic body 2 is formed as a placing surface 3 used for placing a semiconductor wafer W. The ceramic body 2 is provided with a protective layer 4 on at least one main surface and the emitted amount ofα-rays from the protective layer 4 is adjusted to≤0.3 DPH/cm<SP>2</SP>. Consequently, the malfunction of the wafer supporting member 1 can be prevented. In addition, the malfunction of the member 1 can also be prevented by reducing the U, Th, or Ra content of the protective layer 4. COPYRIGHT: (C)2004,JPO |
