发明名称 SUBSTRATE PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To realize a substrate processing system in which the number of steps of surface treatment can be increased easily. SOLUTION: In the substrate processing system where a load lock unit 30 and a process unit 50 are coupled around a vacuum conveyor 40, a batch processing unit 60 for processing a plurality of substrates simultaneously is attached to or built in the load lock unit 30. Consequently, the type of process can be increased without increasing the number of coupling chambers of the vacuum conveyor. Throughput is also enhanced. In addition, drying capacity is enhanced by producing high vacuum in the load lock unit 30 and performing heating in the batch processing unit. Furthermore, a conveying mechanism 28 becomes a semibatch mechanism by transferring a substrate shape measuring unit to a process unit 70. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119401(A) 申请公布日期 2004.04.15
申请号 JP20020276298 申请日期 2002.09.20
申请人 FOI:KK 发明人 SAITO NAOMICHI
分类号 H01L21/677;H01L21/027;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
代理机构 代理人
主权项
地址