发明名称 |
BONDING FOR A MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND MEMS BASED DEVICES |
摘要 |
A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device. |
申请公布号 |
WO03072487(A3) |
申请公布日期 |
2004.04.15 |
申请号 |
WO2003US05586 |
申请日期 |
2003.02.25 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
PLATT, WILLIAM, P.;FORD, CAROL, M. |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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