发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser. |
申请公布号 |
US2004072512(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030664156 |
申请日期 |
2003.09.17 |
申请人 |
KIMURA NORIO;ISHII YOU;TATEYAMA YOSHIKUNI |
发明人 |
KIMURA NORIO;ISHII YOU;TATEYAMA YOSHIKUNI |
分类号 |
B24B37/00;B24B1/00;B24B37/04;B24B53/007;B24B53/017;B24B53/02;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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