DEFECT DATA ANALYTIC METHOD, APPARATUS FOR THE SAME AND REVIEW SYSTEM

摘要

PROBLEM TO BE SOLVED: To analyze a defect distribution state based on defect data detected by an inspection apparatus and easily identify a defect reason due to an apparatus or a process in a semiconductor wafer manufacturing process.

SOLUTION: A defect data analytic method analyzes the defect distribution state based on defect location coordinates detected by the inspection apparatus and categorizes the defect distribution state into one of distribution feature categories including repetitive defects, aggregate defects, circular distribution defects, radial distribution defects, linear distribution defects, ring or cluster distribution defects and random defects.

COPYRIGHT: (C)2004,JPO