| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a camera module small in size and thin in thickness, in which a chip set such as an imaging device 13 is sealed with a transparent resin 15. <P>SOLUTION: The camera module 10 is composed of a conductive pattern 11, a signal processing element 12 packaged on the conductive pattern 11 facedown to shield a surface where the element formed, the imaging device 13 fixed on the signal processing element 12, a metal fine line 16 for electrically connecting the imaging device 13 and the conductive pattern 11, the transparent resin 15 coating the imaging device 13 and the metal fine line 16, and a lens 24 located above the imaging device 13. <P>COPYRIGHT: (C)2004,JPO |
