| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier material for polishing having high rigidity with less generation of warpage, excellent in dimensional stability and board thickness accuracy, having high abrasion resistance, hardly scratching a surface or an outer peripheral surface of an object to be polished when holding and polishing the object such as a semiconductor wafer and a hard disk, and having a high cost advantage in manufacturing. <P>SOLUTION: The carrier material is processed as a carrier 1 for polishing to be used for holding the object to be polished for polishing it. A plurality of pre-preg including the pre-preg made by impregnating molten liquid crystal whole aromatic polyester fiber base material with thermosetting resin and drying it are laminated and subjected to heating pressure forming. <P>COPYRIGHT: (C)2004,JPO |
