发明名称 CHIP RESISTOR, ITS MANUFACTURING METHOD AND METHOD FOR PACKAGING SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a chip resistor wherein incorporation in a multilayer circuit board is easy, packaging area can be used effectively, and stable resistance value can be realized with high precision when e.g. outline dimension is made equal to or smaller than that of types of 1005 and 0603, and especially, its thickness is reduced to at most one-half of 0.23mm. <P>SOLUTION: The chip resistor is provided with a sheet-like resin based substrate 1 having flexibility, a pair of surface electrode films 2 formed on one side of the resin based substrate 1, a resistor film 3 which is formed of a thin film so as to coat part of a pair of the surface electrode films 2 and electrically connect a part between the coated parts, a protective film 5 for coating the resistor film 3, and a pair of conductive auxiliary films 4 which are formed so as to coat an interior end of each region in which the resistor film 3 and a pair of the surface electrode films 2 are overlapped, respectively. As a result, the chip resistor wherein electrical connection between the resistor film 3 and a pair of the surface electrode films 2 are made superior is obtained. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004119500(A) 申请公布日期 2004.04.15
申请号 JP20020277935 申请日期 2002.09.24
申请人 KAMAYA DENKI KK 发明人 HIRANO TATSUKI
分类号 H01C17/06;H01C7/00;(IPC1-7):H01C7/00 主分类号 H01C17/06
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