| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material which is used for sealing, does not contain a halogen and antimony, does not deteriorate the reliability of moldability, reflow resistance, moisture resistance, high temperature left characteristics, and the like, scarcely warps, and has good flame retardancy, and to provide an electronic part device having an element sealed with the epoxy resin molding material. <P>SOLUTION: This epoxy resin molding material used for sealing is characterized by containing (A) a triazine ring-having epoxy resin, (B) a curing agent, and (C) an organic compound having at least one of phosphorus-oxygen bond and phosphorus-sulfur bond, as essential components. <P>COPYRIGHT: (C)2004,JPO</p> |
