发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To control the occurrence of mechanical damages and contamination in the substrate when the substrates are received without lowering the total processing speed. SOLUTION: While a first quartz susceptor 20 is stopped, a transfer jig 36 loading the substrate 12 is moved downward in the operating speed V1. When the substrate 12 is transferred to the first susceptor 20 from the transfer jig 36 while the transfer jig 36 is moved downward continuously in the operating speed V1, the first quartz susceptor 20 is moved downward in the operating speed V2' (V1 is larger than V2'), and the substrate 12 is transferred to the first quartz susceptor 20 from the transfer jig 36. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119642(A) 申请公布日期 2004.04.15
申请号 JP20020280165 申请日期 2002.09.26
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 IMAI YOSHINORI
分类号 H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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