| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming an ultrafine sintered wiring pattern by baking nano-sized metal particles contained in a drawn ultrafine pattern at a relatively low temperature after drawing the pattern, by using a dispersion prepared by dispersing the nano-sized metal particles in a dispersion medium that can be removed easily by evaporating. SOLUTION: In a step of drawing the ultrafine wiring pattern, an applied layer is formed on a substrate by jetting dispersed nano-sized metal particles in the dispersion medium composed of a supercritical fluid under a pressurized and heated condition from a nozzle. Consequently, the dispersion medium composed of the supercritical fluid can be removed by evaporating, because the medium quickly changes to a gaseou state under the atmospheric pressure. COPYRIGHT: (C)2004,JPO
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