发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the response and reliability of a temperature sensor. SOLUTION: In a temperature sensor 16 used in a semiconductor manufacturing device having a vertical reaction chamber 10, the outer diameter of a first protective tube 17 including a temperature measurement part 15 is thinned and the outer diameter of a second protective tube 18 which does not include the temperature measurement part 15 is enlarged, thus realizing different outer diameters of the protection tube. Since the outer diameter of the protective tube 17 including the temperature measurement part 15 is thin, response to the temperature is high and errors are less. Meanwhile, since the outer diameter of the protective tube 18 which does not include the temperature measurement part 15 is large, space between thermo-couple wires 13 is wide and insulation resistance between thermo-couple wires is large. If insulation resistance between thermo-couple wires is large, temperature is not detected outside the temperature measurement part 15, and highly reliable temperature measurement is possible. Since the outer diameter of the protective tube is large, it is hard to be damaged. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119788(A) 申请公布日期 2004.04.15
申请号 JP20020282707 申请日期 2002.09.27
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAGOME KAZUHIRO
分类号 H01L21/205;(IPC1-7):H01L21/205 主分类号 H01L21/205
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