摘要 |
PROBLEM TO BE SOLVED: To provide a reliable conductive adhesive with excellent conductivity whose conductivity is not affected by intense heat due to dipping into a soldering bath or heating for curing of a thermosetting resin. SOLUTION: The composition consists of (A) organopolysiloxane having an alkenyl group bonded with two or more silicon atoms in a molecule, (B) organopolysiloxane containing two or more silicon atoms in a molecule and having at least one hydrogen atom per one silicon atom, (C) a catalyst volume of platinum system hydrosilylation catalyst and (D) conductive fine particles of a volume enough to represent conductivity. COPYRIGHT: (C)2004,JPO
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