发明名称 CONDUCTIVE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a reliable conductive adhesive with excellent conductivity whose conductivity is not affected by intense heat due to dipping into a soldering bath or heating for curing of a thermosetting resin. SOLUTION: The composition consists of (A) organopolysiloxane having an alkenyl group bonded with two or more silicon atoms in a molecule, (B) organopolysiloxane containing two or more silicon atoms in a molecule and having at least one hydrogen atom per one silicon atom, (C) a catalyst volume of platinum system hydrosilylation catalyst and (D) conductive fine particles of a volume enough to represent conductivity. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119254(A) 申请公布日期 2004.04.15
申请号 JP20020282739 申请日期 2002.09.27
申请人 THREE BOND CO LTD 发明人 SUZUKI HIRONORI
分类号 C09J9/02;C09J183/05;C09J183/07;H01B1/24;(IPC1-7):H01B1/24 主分类号 C09J9/02
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