发明名称 |
Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices |
摘要 |
Devices for manipulating, receiving and dispensing diced semiconductor materials, in which the semiconductor material is diced to provide partially connected dice in linear aggregations. |
申请公布号 |
US2004072385(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20020269326 |
申请日期 |
2002.10.15 |
申请人 |
BAUER DONALD G.;BRYDEN MICHELLE D.;COLLINS RICHARD A.;SPEDDEN RICHARD H. |
发明人 |
BAUER DONALD G.;BRYDEN MICHELLE D.;COLLINS RICHARD A.;SPEDDEN RICHARD H. |
分类号 |
H01L21/00;H01L21/673;H01L21/68;H01L21/78;H01L23/544;(IPC1-7):H01L21/00;H01L21/301;H01L21/46 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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