发明名称 Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices
摘要 Devices for manipulating, receiving and dispensing diced semiconductor materials, in which the semiconductor material is diced to provide partially connected dice in linear aggregations.
申请公布号 US2004072385(A1) 申请公布日期 2004.04.15
申请号 US20020269326 申请日期 2002.10.15
申请人 BAUER DONALD G.;BRYDEN MICHELLE D.;COLLINS RICHARD A.;SPEDDEN RICHARD H. 发明人 BAUER DONALD G.;BRYDEN MICHELLE D.;COLLINS RICHARD A.;SPEDDEN RICHARD H.
分类号 H01L21/00;H01L21/673;H01L21/68;H01L21/78;H01L23/544;(IPC1-7):H01L21/00;H01L21/301;H01L21/46 主分类号 H01L21/00
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