Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate by electrostatic force, useful e.g. in display industry, in polymer electronics, photovoltaic industry, sensors and biotechnology

摘要

Composite (I) comprises: (a) a thin substrate (TS) having less than 0.3 mm thickness and a top side as well as an under side; and (b) a carrier substrate (CS) with a top side and an underside, where the underside of TS is releasably bound to the topside of CS. TS is an insulator and is held onto CS through electrostatic force. Independent claims are also included for the following: (A) preparation of (I); (B) treatment and/or processing and/or transport of TS.