METHOD OF MANUFACTURING PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING INK JET HEAD

摘要

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a piezoelectric element and increase the reliability thereof by suppressing the occurrence of cracks in a piezoelectric thin film layer 16 when forming, on a substrate 11, the piezoelectric thin film layer 16 having a coefficient of linear expansion larger than that of the substrate 11.

SOLUTION: In a process of forming the piezoelectric thin film layer 16, a compressive stress is applied to the piezoelectric thin film layer 16 when it is formed in order to reduce the tensile stress occurring in the piezoelectric thin film layer 16 due to a difference in shrinkage between the substrate 11 and the piezoelectric thin film layer 16 when the piezoelectric thin film 16 is cooled after formation. Specifically, when forming the piezoelectric thin film layer 16 by a sputtering method, a bias not less than -30V nor more than 0V is applied to the substrate 11 at the time of sputtering to apply compressive stress to the piezoelectric thin film layer 16.

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