| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To overcome a problem that peeling or crack is caused between a capacitor element and an insulating layer in a board with the built-in capacitor. <P>SOLUTION: The manufacturing method of the wiring board 6 with the built-in capacitor 3 comprises the steps of: laminating a plurality of insulating layers 1 including coating layers 12 composed of a polyphenylen ether-based organic material coated on the upper and lower surfaces of a liquid crystal polymer layer 11 and forming wiring conductors 2 thereon; electrically connecting between the wiring conductors 2 arranged in upper and lower positions interposing the insulating layers 1 via penetrating conductors 13; and forming drawing-out electrodes 5 electrically connected with the wiring conductors 2 or penetrating conductors 13 inside the penetrating hole 4 arranged at least in one insulating layer 1. In the liquid crystal polymer layer 11, a wave shape on the inner periphery of the cross section of the penetrating hole 4 has a repetition length 7 of 1-10μm and the maximum height (Ry) 8 of 20-200μm, and the capacitor element 3 is fixed to the inner face of the penetrating hole 4 in the liquid crystal polymer layer 11 via an adhesive 12a composed of the polyphenylen ether-based organic material. <P>COPYRIGHT: (C)2004,JPO</p> |
