| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board having solder bumps in which voids are hardly formed and through which the electrodes of an electronic component can be joined firmly to the soldering pads. SOLUTION: On the surface of an insulating substrate 1, a plurality of soldering pads 3 and solder-resistant resin layers 4 having openings 4a through which the central parts of the pads 3 are exposed are formed. Then the soldering pads 3 are coated with solder layers 21 by dipping the substrate 1 in molten solder, and solder paste 22 is applied to the solder layers 21 by printing. Thereafter, the solder bumps 5 are formed by melting the solder in the solder layers 21 and solder paste 22. COPYRIGHT: (C)2004,JPO
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